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F-214 (Rev 04APR14)
MEC8 –140 –02 –L–D –EM2
MEC8 –140 –02 –L–D –RA1
MEC8 –160 –02 –L–D –EM2
(0,80 mm) .0315"
MEC8 –110 –02 –L–D –RA1
MEC8-RA, MEC8-EM SERIES
RIGHT ANGLE/EDGE MOUNT SOCKETS
Mates with:
(1,60 mm) .062" thick cards
SPECIFICATIONS
MEC8
1
POSITIONS
PER ROW
02
PLATING
OPTION
D
RA1
OTHER
OPTION
For complete speci?cations and
recommended PCB layouts see
www.samtec.com?MEC8-RA
Insulator Material: Black LCP
Contact Material:
Phosphor Bronze
Plating: Au or Sn over
Note: Some sizes,
styles and options
are non-standard,
non-returnable.
10, 13, 20, 25,
30, 37, 40, 49, 50
–L
= 10μ" (0,25 μm) Gold on contact,
Matte Tin on tail
–TR
= Tape & Reel
Packaging
40 (18,90) (36,60)
50 (22,90) (44,60)
50μ" (1,27 μm) Ni
Operating Temp Range:
-55°C to +125°C
Insertion Depth:
(3,94 mm) .155" to
(6,25 mm) .246"
Current Rating:
2.0 A per pin
(6 adjacent pins powered)
Voltage Rating: 265 VAC
POS.
PER A B
ROW
.744 1.441
.902 1.756
02
01
No. of Positions x (0,80) .0315 + (3,00) .118
(0,80) .0315
(7,40)
.291
MEC8-RA Rated @ 3dB Insertion Loss*
Single-Ended Signaling 8.5 GHz / 17 Gbps
Differential Pair Signaling 9.5 GHz / 19 Gbps
*Test board losses de-embedded from performance data.
Complete test data available at www.samtec.com?MEC8-RA
or contact sig@samtec.com
RoHS Compliant: Yes
Lead–Free Solderable: Yes
RECOGNITIONS
No. of Positions x (0,80) .0315 + (6,20) .244
B
A
(1,80)
.071
ALSO
AVAILABLE
(MOQ Required)
For complete scope of
recognitions see
(5,77)
.227 (2,65)
.104
(3,53)
.139
? 1 mm mating card
thickness option
www.samtec.com/quality
(0,90) .035 x
(1,40) .055 DIA
(2,00) .0787
(4,00)
.157
(1,40)
.055
DIA
(0,95)
.037
(9,10) .358
(1,05)
.041
? Latching option
Contact Samtec.
Mates with:
(1,60 mm) .062" thick cards
SPECIFICATIONS
MEC8
1
POSITIONS
PER ROW
02
PLATING
OPTION
D
–EM2
For complete speci?cations and
recommended PCB layouts see
www.samtec.com?MEC8-EM
Insulator Material: Black LCP
Contact Material:
Phosphor Bronze
Plating: Au or Sn over
10, 20, 30, 40, 50, 60, 70
–L
= 10μ" (0,25 μm) Gold on contact,
Matte Tin on tail
–EM2
= (1,60 mm) .062"
thick PCB
50μ" (1,27 μm) Ni
Operating Temp Range:
No. of Positions x (0,80) .0315 + (7,80) .307
MEC8-EM Rated @ 3dB Insertion Loss*
-55°C to +125°C
Insertion Depth:
(4,32 mm) .170" to
02
A
B
Single-Ended Signaling 9.5 GHz / 18 Gbps
Differential Pair Signaling 9 GHz / 18 Gbps
(5,66 mm) .223"
Current Rating: 1.8 A per pin
(6 adjacent pins powered)
Voltage Rating:
*Test board losses de-embedded from performance data.
Complete test data available at www.samtec.com?MEC8-EM
or contact sig@samtec.com
(2,00) .0787
265 VAC
RoHS Compliant: Yes
Lead–Free Solderable: Yes
RECOGNITIONS
For complete scope of
recognitions see
(1,80)
.071
01
(4,00)
.157
No. of Positions x (0,80) .0315 + (4,60) .181
(7,00)
.276
(8,50)
.335
POSITIONS
PER ROW
40
50
60
70
A
(18,90) .744
(22,90) .902
(26,90) 1.059
(30,90) 1.217
B
(36,60) 1.441
(44,60) 1.756
(52,60) 2.071
(60,60) 2.386
www.samtec.com/quality
ALSO AVAILABLE
(MOQ Required)
Note: Some sizes, styles and
options are non-standard,
non-returnable.
(5,00)
.197
(0,80)
.0315
(1,48)
.058
? 1 mm mating card thickness option
Contact Samtec.
WWW.SAMTEC.COM
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相关PDF资料
MEC8-150-01-L-DV-A CONN EDGE CARD DL 100POS SMD
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